Micron Technology, a memory industry giant, is ramping up its production of high-bandwidth memory (HBM) to meet the surging demand in the era of artificial intelligence (AI). This initiative includes establishing a pilot HBM production line in the United States and considering the construction of the first HBM production facility in Malaysia.
According to Nikkei Asia, the HBM R&D facility in Boise, Idaho, is being expanded to include a production and verification line. Micron's largest HBM production facility, located in Taichung, Taiwan, is also undergoing expansion. Additionally, Micron is considering Malaysia, where they already have a chip testing and assembly plant, as a location for new HBM production.
Micron's goal is to increase its HBM market share to 24-26% by the end of 2025, approaching its traditional DRAM market share of around 23-25%.
Previously, Micron was also reported to be building a new DRAM factory in Hiroshima, Japan. Construction is scheduled to begin in early 2026 and is expected to be completed by the end of 2027. This factory will be located next to the existing Fab15 facility and will focus on DRAM production, with an emphasis on HBM products.
